Armstrong Fluid Technology has unveiled Envelope, a cutting-edge digital platform designed to connect mechanical system components and deliver substantial cost and energy savings.
The Envelope platform integrates Armstrong and partner solutions, providing system optimization through advanced performance mapping, sophisticated analytics, and comprehensive lifecycle services.
At the core of Envelope is its ability to generate detailed performance profiles for system components. These profiles are leveraged to ensure optimal sizing and output modulation, enhancing overall system efficiency.
“The real strength of the Envelope platform lies in its ability to optimize system performance through seamless integration with partner products or solutions,” said Pratik Sharma, Global Director of Building Services & Performance Management at Armstrong Fluid Technology. “By utilizing this platform, Armstrong and digitally controlled solutions can connect and coordinate operations to boost performance and efficiency. The platform can link with various components, such as chillers, cooling towers, boilers, and heat pumps, from a wide range of established industry manufacturers.”
